IEEE ISCAS 2016, Montreal, Canada
The IEEE International Symposium on Circuits and Systems (ISCAS) is the world’s largest networking forum of leading researchers in the highly active fields of theory, design and implementation of circuits and systems. The 2016 edition, sponsored by the IEEE Circuits and Systems Society and supported by the Microsystems Strategic Alliance of Québec (ReSMiQ), will be held in Montréal, Canada, from May 22 to 25, 2016. The unifying theme for the conference, “Toward Innovative Nanosystems for Greater Well Being”, will focus on circuits and systems that will strongly influence human well-being and quality of life. The technical program will be tailored to reflect the wide spectrum of topics and research interests shared by researchers in the field
Registration
Authors’ registration: February 15, 2016
Advanced registration: March 7, 2016
Website: www.iscas2016.org
LASCAS 2016, Florianópolis, Brazil (Feb-March 2016)
LASCAS is the international symposium and flagship event of the IEEE Circuits and Systems Society in Latin America. Its seventh edition will take place on Ingleses Beach, Florianopolis, Brazil. The symposium will cover technical novelties and tutorial overviews on circuits and systems topics including but not limited to:
• Analog and Digital Circuits
• Mixed-Mode Circuits
• Biomedical Electronics
• Communication/RF Circuits
• Wireless Sensor Networks
• Nanoelectronics
• Electronic Design Automation
• VLSI Systems and Applications
• FPGA Design and Applications
• Circuit Testing
• Fault Tolerant Circuits
Conference website: http://gse.ufsc.br/lascas2016/lascas2016/ .
VLSI-DAT 2016, Hsinchu, Taiwan (April 2016)
The 2016 International Symposium on VLSI Design, Automation and Test will be held on April 25-27, 2016 at the Ambassador Hotel, Hsinchu, Taiwan. Original, unpublished papers on all aspects of VLSI Design, Automation and Test are solicited, including but not limited to:
DESIGN TOPICS
- RF, Analog and Mixed-Signal Circuits
- Sensors and Interface Circuits
- Memory Circuits and Systems
- Digital Circuits and ASIC
- Communication Circuits
- Multimedia Processing Circuits
- Biomedical Circuits
- Energy-Harvesting and Power Circuits
- SoC and NoC Architectures
- CPU, DSP and Multicore Architectures
- Designs Using Novel Technologies
- System-in-Package Design
- Ultra Low-Power Circuits, Architectures, and Systems
EDA TOPICS
-Logic and Architecture Synthesis
-Physical Design and Verification
-Design for Manufacturability
-Power Estimation and Optimization
-Design Verification
-Modeling and Simulation
-Electronic System Level Design
-Hardware-Software Co-Design
-Embedded Systems and Software
TEST TOPICS
-Test Generation and Compression
-Design-for-Testability and BIST
-RF, Analog and Mixed-Signal Test
-SOC and System Level Test
-Silicon Debug and Diagnosis
-3D IC and Interposer-Based IC Test
-Yield and Reliability Enhancement
-On-Chip Monitoring
-Adaptive Test
-Test Standards
Prospective authors should submit a self-contained paper with figures and tables electronically through the conference website by October 16, 2015 23:59 (GMT +0800. Details of submission requirements are found in http://expo.itri.org.tw/2016vlsidat
SPI 2016, Turin, Italy (May 2016)
Over the past nineteen years, the IEEE Workshop on Signal and Power Integrity (SPI) has evolved into a forum of exchange on the latest research and developments on design, characterization, modeling, simulation and testing for Signal and Power Integrity at chip, package, board and system level. The workshop brings together developers and researchers from industry and academia in order to encourage cooperation. In view of last years success, the Committee is looking forward to the 20th Edition which will convene in Turin, Italy. The SPI 2016 technical program will include both oral and poster sessions. A number of prominent experts will be giving tutorials on areas of emerging interest. The Conference Proceedings will be published with an ISBN code and will appear in IEEE Xplore.
Topics of Interest:
-Innovative schemes for SI and PI
-Noise reduction techniques
-High-speed link design and modeling
-Power distribution networks
-Electronic packages and microsystems
-3D technologies for IC and packages
-RF, microwave, mixed signal packaging
-Nano-interconnects and nano-structures
-Electromagnetic theory and modeling
-Transmission line theory and modeling
-Macro-modeling, reduced order models
-Simulation tools for SI and PI
-Electromagnetic Compatibility
-Design methodology/flow
-Measurements
-Jitter and noise modeling
-Chip-package co-design
-Novel CAD concepts
Important Dates:
Paper submission (2-4 pages): January 31, 2016
Notification of acceptance: February 28, 2016
Conference website: http://www.spi2016.org/
IEEE RFIC 2016, San Francisco, USA (May 2016)
The 2016 IEEE Radio Frequency Integrated Circuits Symposium (RFIC 2016) will be held in San Francisco, CA, USA, on May 22-24, 2016. For the latest information, please visit: rfic-ieee.org.
Technical Areas: The conference will solicit papers describing original work in RFIC circuits, system engineering, design methodology, RF modeling and CAD simulation, RFIC technologies, devices, fabrication, testing, reliability, packaging and modules to support RF applications.
Technical Format: The conference starts on Sunday, May 22, 2016 with workshops and short courses, followed by two Plenary talks and Reception embedded with joint Industry Showcase and Interactive Forum. Monday, May 23 and Tuesday, May 24, 2016 will be comprised of presentations of contributed papers and special lunch-time panel sessions. RFIC also seeks 2-page short-format original industrial-only submissions on all the areas listed above. RFIC Symposium has Best Student Paper Award and Industry Best Paper Award.
Journal Submissions: Selected papers will be invited for special issues in IEEE Journal of Solid State Circuits and Transactions on Microwave Theory and Techniques.
Microwave Week 2016: The RFIC 2016 will be held in conjunction with the IEEE MTT-S International Microwave Symposium (IMS). Microwave Week 2016 will start with RFIC Symposium, and followed by IMS Symposium, Microwave Historical Exhibit and ARFTG Microwave Measurement Conference.
Industrial Exhibition: This two-day Exhibition expects about 1000 Exhibitors who represent the state-of-the-art of the industry covering everything needed for RF and microwave production including materials, technologies, components and subsystems, as well as RF IC design and simulation software, and measurement and fabrication equipment. It is a perfect venue for engineers to find the newest on RF and microwave ICs.
Electronic Submission Deadlines
Technical Paper Summaries in PDF format:8 January 2016
Final Manuscripts for the Digest and CD-ROM: 9 March 2016
IEEE Computer Society Annual Symposium on VLSI, Pittsburg, USA (July 2016)
This Symposium, to be held in July 11-13, 2016, Pittsburgh, PA, USA, explores emerging trends and novel ideas and concepts in the area of VLSI. The Symposium covers a range of topics: from VLSI circuits, systems and design methods to system level design and system-on-chip issues, to bringing VLSI experience to new areas and technologies. Future design methodologies as well as new CAD tools to support them will also be the key topics. ISVLSI 2016 highlights a special theme of cyber-physical system.
The papers from this symposium have been published as the special issue to top archival journals. The symposium proceedings are published by IEEE-CS conference publication services (CPS). The Symposium has established a reputation in bringing well-known international scientists as invited speakers, and this trend will continue.
Contributions are sought in the following areas:
1) Analog and Mixed-Signal Circuits (AMS)
2) Computer-Aided Design and Verification (CAD)
3) Digital Circuits and FPGA based Designs (DCF)
4) Emerging and Post-CMOS Technologies (EPT)
5) System Design and Security (SDS)
6) Testing, Reliability, and Fault-Tolerance (TRF)
The Symposium Program will include contributed papers and speakers invited by the Program Committee as well as a poster session. The keynotes, special sessions and Student Research Forum are planned as well. Authors are invited to submit full-length, original, unpublished papers. To enable blind review, the author list should be omitted from the main document.
Paper submission deadlines:
Special Session Proposal Deadline: January 22, 2016
Paper Submission Deadline: February 19, 2016
Student Research Forum Submission Deadline: February 19, 2016
Acceptance Notification: April 15, 2016
Submission of Final Version: May 13, 2016
Authors of a selected top quality papers from ISVLSI 2016 depending on the technical scope will be invited to submit extended versions of these papers to Special Issues like "Nanoelectronic Devices and Circuits for Next Generation Sensing and Information Processing" in IEEE TNANO and "Circuit and System Design Automation for Internet of Things" in IEEE TCAD.
Conference website: www.isvlsi.org