Chi Kong Tse

ISCAS Co-Publication with CAS Transactions

IEEE Transactions on Circuits and Systems – Part I and Part II (TCAS-I and TCAS-II) will implement a new co-publication initiative of the IEEE Circuits and Systems Society (CASS) to publish Special Issues containing a selection of the best papers accepted for presentation at the IEEE International Symposium on Circuits and Systems (ISCAS), held in Florence, Italy, on May 27-30, 2018. All papers will be reviewed by two Guest Editorial teams formed for the respective Transactions and according to the respective Transactions' review policies.

For TCAS-I, full papers expanding the ideas presented at ISCAS will be published in a Special Issue. However, as TCAS-II only publishes 5-page briefs, and hence both conference and journal (revised) versions of these works would be largely overlapped, the papers included in the TCAS-II Special Issue represent the only record published in IEEE Xplore and they will not appear in the Proceedings of IEEE ISCAS, which will however contain DOI links to the corresponding TCAS-II papers. With this initiative, CASS joins other forward looking IEEE Societies, namely, the IEEE Robotics and Automation Society and IEEE Control Systems Society, which have developed a similar process for presenting papers submitted to the IEEE Robotics and Automation Letters or to the IEEE Control Systems Letters at ICRA, CASE, or IROS and to CDC, respectively. In a world where the role of a conference is shifting more and more to a networking event and a scientific discussion opportunity, and in which the importance of conference publications is vanishing (except for some specific fields), we consider this opportunity an important step forward for the CAS community. 

The ISCAS Special Issue in TCAS-II will appear in May 2018, synchronizing with ISCAS at Florence, and that in TCAS-I will appear at a later time.

José M. de la Rosa, Deputy EiC, IEEE TCAS-II, and
Gianluca Setti, General Co-Chair, ISCAS 2018

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Search for Editor-In-Chief of the IEEE Transactions on Very Large Scale Integration (VLSI) Systems

The IEEE Transactions on Very Large Scale Integration (VLSI) Systems (TVLSI) is published as an archival monthly journal under the co-sponsorship of the IEEE Circuits and Systems Society, the IEEE Computer Society, and the IEEE Solid-State Circuits Society. We are currently seeking nominations and applications for the position of the Editor-in-Chief (EIC) of the IEEE TVLSI for the publication years 2019 and 2020.

The design and realization of microelectronic systems based on nanometer VLSI technologies require multidisciplinary collaboration in the fields of systems architecture, logic and circuit design, integrated circuit fabrication, packaging, testing, systems applications, novel systems platforms (such as 3-D integration), and emerging technologies. Generation of specifications, design, and verification must be performed at all abstraction levels, including the system, register-transfer, logic, circuit, transistor, process, and materials levels. The IEEE TVLSI serves as a common forum to address these critical areas. The editorial board, consisting of international experts, invites original papers which emphasize and focus on the novel systems integration aspects of microelectronic systems, including interactions among systems design and partitioning, logic and memory design, digital and analog circuit design, physical design, layout synthesis, CAD tools, integrated circuit fabrication, testing and packaging, emerging technologies, and systems level design and analysis. Coverage of these Transactions will, therefore, focus on nanometer VLSI systems integration. For more information on the journal, refer to http://tvlsi.egr.duke.edu.

Applicants must have strong, relevant experience in roles such as author, reviewer, and associate editor for TVLSI and/or other related journals, and/or a technical program chair or similar roles in high-quality, peer-reviewed conferences. To attract high-quality papers to the journal, the EIC must also be a well-recognized leader in his/her areas of expertise. Key qualities of the EIC are an outstanding understanding of the needs of the research community at academic as well as industrial and government laboratories, awareness of changing emphases in research areas and development of emerging fields, plus the administrative skills to manage the editorial cycle in a timely fashion. The EIC must also be able to attract respected experts to his/her editorial board. The EIC must have good interpersonal skills to maintain good rapport with authors, editors, reviewers, and the IEEE staff.

Applications or nominations must include:

• an application/nomination letter
• a complete curriculum vitae (CV)
• a personal statement summarizing their vision and plans for TVLSI
• a letter from their employer indicating support for the EIC activity

The nomination deadline is 30 April 2018. The target start date for the new EIC is 1 January 2019.

INSTRUCTION FOR NOMINATION: Please send an email with the materials as a single zip file and with the subject line "IEEE TVLSI EiC application" to henkel@kit.edu. Make sure to receive a confirmation within two days of submission.

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Latest Tables of Contents of CAS Sponsored Journals

The latest issues of our CAS sponored journals have been published and the tables of contents can be accessed through the following links:

• IEEE Transactions on Circuits and Systems I: Regular Papers
• IEEE Transactions on Circuits and Systems II: Express Briefs
• IEEE Transactions on Circuits and Systems for Video Technology
• IEEE Journal on Emerging and Selected Topics in Circuits and Systems
• IEEE Circuits and Systems Magazine
• IEEE Transactions on Biomedical Circuits and Systems
• IEEE Design and Test Magazine