Chi Kong Tse

New Digital Version of IEEE CAS Magazine

The IEEE Circuits and Systems Magazine has launched a full digital version. Members can now browse the latest issue of the magazine by clicking this link.

Features in this Issue

Singularities of Nonlinear Circuit Theory and Applications: Achievements of Professor Leon Ong Chua
Sung-Mo “Steve” Kang

Oscillation with 4-Lobe Chua Corsage Memristor
Zubaer Ibna Mannan, Changju Yang, and Hyongsuk Kim

Tutorial: Experimental Nonlinear Dynamical Circuit Analysis of a Ferromagnetic Inductor
Suhas Kumar and R. Stanley Williams

About Fingerprints of Chua’s Memristors
Dalibor Biolek and Zdeněk Biolek

Exploring the Dynamics of Real-World Memristors on the Basis of Circuit Theoretic Model Predictions
A. Ascoli, R. Tetzlaff, and S. Menzel

CNN Technology—Tools and Applications
Ákos Zarándy, András Horváth, and Péter Szolgay

CMOS Vision Sensors: Embedding Computer Vision at Imaging Front-Ends
A. Rodríguez-Vázquez, J. Fernández-Berni, J.A. Leñero-Bardallo, I. Vornicu, and R. Carmona-Galán

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Search for Editor-In-Chief of the IEEE Transactions on Very Large Scale Integration (VLSI) Systems

The IEEE Transactions on Very Large Scale Integration (VLSI) Systems (TVLSI) is published as an archival monthly journal under the co-sponsorship of the IEEE Circuits and Systems Society, the IEEE Computer Society, and the IEEE Solid-State Circuits Society. We are currently seeking nominations and applications for the position of the Editor-in-Chief (EIC) of the IEEE TVLSI for the publication years 2019 and 2020.

The design and realization of microelectronic systems based on nanometer VLSI technologies require multidisciplinary collaboration in the fields of systems architecture, logic and circuit design, integrated circuit fabrication, packaging, testing, systems applications, novel systems platforms (such as 3-D integration), and emerging technologies. Generation of specifications, design, and verification must be performed at all abstraction levels, including the system, register-transfer, logic, circuit, transistor, process, and materials levels. The IEEE TVLSI serves as a common forum to address these critical areas. The editorial board, consisting of international experts, invites original papers which emphasize and focus on the novel systems integration aspects of microelectronic systems, including interactions among systems design and partitioning, logic and memory design, digital and analog circuit design, physical design, layout synthesis, CAD tools, integrated circuit fabrication, testing and packaging, emerging technologies, and systems level design and analysis. Coverage of these Transactions will, therefore, focus on nanometer VLSI systems integration. For more information on the journal, refer to http://tvlsi.egr.duke.edu.

Applicants must have strong, relevant experience in roles such as author, reviewer, and associate editor for TVLSI and/or other related journals, and/or a technical program chair or similar roles in high-quality, peer-reviewed conferences. To attract high-quality papers to the journal, the EIC must also be a well-recognized leader in his/her areas of expertise. Key qualities of the EIC are an outstanding understanding of the needs of the research community at academic as well as industrial and government laboratories, awareness of changing emphases in research areas and development of emerging fields, plus the administrative skills to manage the editorial cycle in a timely fashion. The EIC must also be able to attract respected experts to his/her editorial board. The EIC must have good interpersonal skills to maintain good rapport with authors, editors, reviewers, and the IEEE staff.

Applications or nominations must include:

• an application/nomination letter
• a complete curriculum vitae (CV)
• a personal statement summarizing their vision and plans for TVLSI
• a letter from their employer indicating support for the EIC activity

The nomination deadline is 30 April 2018. The target start date for the new EIC is 1 January 2019.

INSTRUCTION FOR NOMINATION: Please send an email with the materials as a single zip file and with the subject line "IEEE TVLSI EiC application" to henkel@kit.edu. Make sure to receive a confirmation within two days of submission.

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Latest Tables of Contents of CAS Sponsored Journals

The latest issues of our CAS sponored journals have been published and the tables of contents can be accessed through the following links:

• IEEE Transactions on Circuits and Systems I: Regular Papers
• IEEE Transactions on Circuits and Systems II: Express Briefs
• IEEE Transactions on Circuits and Systems for Video Technology
• IEEE Journal on Emerging and Selected Topics in Circuits and Systems
• IEEE Circuits and Systems Magazine
• IEEE Transactions on Biomedical Circuits and Systems
• IEEE Design and Test Magazine