CFPs: CONFERENCES AND WORKSHOPS
Upcoming Conferences
IEEE ISCAS 2015, Lisbon, Portugal
Potential authors for regular papers, live demos, tutorials, and special sessions, please visit the conference website http://www.iscas2015.org and click the corresponding icons for details. For regular sessions, authors are invited to submit 4-page full papers according to the posted guidelines. Only electronic submissions will be accepted via the Web at: http://www.epapers.org/iscas2015. Authors of accepted papers are expected to present their papers at the Symposium and at least one author of each paper MUST register for the Symposium in order for the papers to be included in the program.
Important Submission Dates:
Tutorials Proposals: 19/9/2014
Special Session Proposals: 19/9/2014
Full papers for Regular Sessions: 10/17/2014
1-page live demos: 10/10/2014
Full papers for special sessions: 31/10/2014
Final papers: 6/2/2015
MORE DETAILS are in http://www.iscas2015.org
IEEE CECS 2014, Marseille, France (December 2014)
The 21st IEEE International Conference on Electronics, Circuits, and Systems (ICECS) edition will be held in Marseille, France from December 7-10, 2014 at the Pharo Palace. ICECS 2014 will include oral and poster sessions, tutorials given by experts on state-of-the-art topics, and special sessions, with the aim of complementing the regular program with topics of particular interest to the circuits and systems community that cut across and beyond disciplines traditionally represented at ICECS.
Conference website: http://www.ieee-icecs2014.org/
IEEE ISQED 2015, Santa Clara, USA (March 2015)
ISQED 2015 theme is IOT - Smart Sensors and Security. Authors are invited to submit papers in following topics:
Electronic Design
- IOT & Smart Sensors Design and Technology
- System-level Design, Methodologies & Tools
- FPGA Architecture, Design, and CAD
- IC Package - Design Interactions & Co-Design
- Advanced 3D ICs & 3D Packaging
- Robust & Power-conscious Circuits & Systems
- Emerging/Innovative Process & Device Technologies and Design Issues
- Design of Reliable Circuits and Systems
- Design of Embedded Systems
Design Automation and IP
- IP Design, quality, interoperability and reuse
- Design Verification and Design for Testability
- Physical Design, Methodologies & Tools
- EDA Methodologies, Tools, Flows
Manufacturing, Semiconductor Process and Devices
- Design for Manufacturability/Yield & Quality
-IC and package level Reliability, Qualification, and Yield
Key Dates:
Final Paper Submission Deadline Oct 17, 2014
Acceptance Notification Dec 5, 2014
Camera-Ready Paper Due Jan 9, 2015
Conference March 2-4 , 2015
Conference website: http://www.isqed.org
VLSI-DAT 2015, Taiwan (April 2015)
The 2015 International Symposium on VLSI Design, Automation and Test (2015 VLSI-DAT) will again be held in the Ambassador Hotel, Hsinchu, Taiwan during April 27-29, 2015. Organized by Industrial Technology Research Institute (ITRI) and technically cooperations with the Institute of Electrical and Electronics Engineers (IEEE), the 2015 VLSI-DAT provides excellent opportunities for close interactions between industrial and scientific researchers via presentations and discussions on innovations and achievements related to VLSI design, automation and test.
In 2015, the VLSI-DAT and the VLSI-TSA will be held again in the same week with three-day overlap. In response to the need of interactions between the technology and design communities, delegates registered for either 2015 VLSI-DAT or 2015 VLSI-TSA will be able to attend the program of both symposia. Original unpublished papers are solicited. Accepted papers will be published by the IEEE and be included in IEEE eXplorer after being presented in the symposium.
The Best Paper Award will be granted in the VLSI-DAT Opening ceremony in 2016.
The winner will be rewarded by a certificate and US$500. Besides, it will offer the registration fee waived of 2016 VLSI-DAT.
Conference website: http://vlsidat.itri.org.tw/2015/General/
IEEE RFIC, Phoenix, USA (May, 2015)
Electronic Paper Submission/Communication: Technical papers must be submitted via the RFIC 2015 website at rfic-ieee.org. Hard copies will not be accepted. Complete information on how and when to submit a paper will be posted on the RFIC 2015.
Technical Areas: The conference will solicit papers describing original work in RFIC design, system engineering, system simulation, design methodology, RFIC circuits, fabrication, testing, and packaging to support RF applications in areas such as, but not limited to:
- WirelessMobileICs:3G/4G/LTE,WCDMA,TD-SCDMA,HSPA,WiMax,MobileTV.
- Wireless Connectivity: WLAN, 802.11xx, Bluetooth, FM, GPS, UWB, Wireless HD.
- Low Power Transceivers: RFID, NFC, Zigbee, WPAN, WBAN, Biomedical, Sensor Nodes.
- RF Front-End Circuits: RF and mm-wave LNAs, mixers, VGAs, phase shifters, RF switches, integrated FEM.
- Mixed-Signal RF and Analog Baseband Circuits: RF and BB Converters (ADC/DAC), Sub-sampling/ Over- sampling Circuits, and all analog baseband circuits including filters and modulators.
- Reconfigurable and Tunable Front-Ends: SDR/Cognitive Radio, Wideband/Multi-band Front-Ends, Digital RF circuits/architectures, RF BIST, and reconfigurable data converters.
- Large-Signal Circuits: Power Amplifiers (RF & mm-Wave), Drivers, Advanced TX circuits, Linearization.
- VCOs and Frequency Multipliers: RF and mm-Wave VCOs, Frequency Multipliers.
- Frequency Generation Circuits: PLLs, Synthesizers, ADPLL, DDS, Frequency Dividers.
- Modeling and CAD: Active/Passive Devices, Packaging, EM Simulation, Co-Simulation.
- Device Technologies: CMOS, SOI, SiGe, GaAs, MEMS, Integrated Passives, Reliability, Characterization, Testing.
- mm-Wave SOCs: mm-wave SOC and SIP systems above 20GHz for data, video, imaging apps, beam steering.
- High-Speed Data Transceivers: Wireline, Wireless, Optical Transceivers, CDRs for High-Speed Data links.
Technical Paper Summaries in PDF format: 12 January 2015
Final Manuscripts for the Digest and CD-ROM: 9 March 2015
All submissions must be made through the RFIC2015 portal in pdf form.
IEEE PRIME 2015, Glasgow, UK (June-July 2015)
Areas of interest:
-Micro/Nanoelectronics
-Semiconductors
-Analog/Digital Signal Processing
-Computer Aided Design
-Analog/Digital/Mixed/RF IC Design
-Integrated Power ICs
-Sensors/Systems and MEMS
-RF, Microwave and mm-wave Circuits
-VLSI and SoC Applications
-Visual Signal Processing
-Energy Scavenging
-Technical Trends & Challenges
- Electronic Skin
- Flexible Electronics
Important dates:
2 February, 2015: Paper Submission Opens
9 March, 2015: Paper Submission Deadline
1 June, 2015: Early Registration Deadline
22 June 2015: Late Registration Deadline
Conference website: http://web.eng.gla.ac.uk/prime2015/
EAMTA/CAMTA 2015, Cordoba, Argentina (July 2015)
10th Argentine School of Micro-Nanoelectronics, Technology and Applications (EAMTA), July 25-Aug 1, 2015, and 9th Argentine Conference on Micro-Nanoelectronics, Technology and Applications (CAMTA), July 30-31, 2015, will be held at Universidad Tecnológica Nacional, Facultad Regional VILLA MARIA, Córdoba, Argentina.
The Argentine School of Micro-Nanoelectronics, Technology and Applications and its associated Conference is a high technical quality forum for researchers, technologists and companies in the fields of micro and nano electronic technologies.
IMPORTANT DATES:
REGULAR papers to appear in IEEE Xplore
Deadline for submission of papers: March 24, 2015
Notification of acceptance: May 16, 2015
Deadline for submission of final papers: June 07, 2015
STUDENT posters
Deadline for submission of STUDENT posters: March 24, 2015
Notification of acceptance: May 16, 2015
STUDENT GRANTS
Period of application for STUDENT grants: May 16 - June 06, 2015
Notification of grants: June 13, 2015
Conference website: www.eamta.com.ar