VOLUME 9, ISSUE 5, OCTOBER 2015

CFPs: CONFERENCES AND WORKSHOPS


Upcoming Conferences

IEEE ISCAS 2016, Montreal, Canada

The IEEE International Symposium on Circuits and Systems (ISCAS) is the world’s largest networking forum of leading researchers in the highly active fields of theory, design and implementation of circuits and systems. The 2016 edition, sponsored by the IEEE Circuits and Systems Society and supported by the Microsystems Strategic Alliance of Québec (ReSMiQ), will be held in Montréal, Canada, from May 22 to 25, 2016. The unifying theme for the conference, “Toward Innovative Nanosystems for Greater Well Being”, will focus on circuits and systems that will strongly influence human well-being and quality of life. The technical program will be tailored to reflect the wide spectrum of topics and research interests shared by researchers in the field

Important Dates

Tutorials

Proposal deadline: September 18, 2015

Notification of selection: October 30, 2015

Special sessions

Proposal deadline: September 18, 2015

Notification of selection: October 9, 2015

Submission deadline of 4-page papers: October 30, 2015

Live demonstration

Proposal deadline: October 9, 2015

Notification of selection: January 11, 2016

Technical sessions (lectures & posters)

Submission deadline of 4-page papers: October 9, 2015
Notification of accepted papers: January 11, 2016

Submission deadline of final paper: February 15, 2016

Registration

Authors’ registration: February 15, 2016

Advanced registration: March 7, 2016

Website: www.iscas2016.org


NOLTA 2015, Hong Kong (December 2015)

The 2015 International Symposium on Nonlinear Theory and its Applications (NOLTA2015) will be held at Hong Kong, China, December 1-4, 2015. The objective of the symposium is to provide a forum for exchange of the latest results related to nonlinear theory and its applications. Papers describing original results in all aspects of nonlinear theory and its applications are invited.

[Apr.15, 2015] Deadline for Special Session proposals

[May 1, 2015] Notification of acceptance for Special Sessions

[Jun. 1, 2015] Deadline for submission of full papers for Regular and Special Sessions

[Aug. 1, 2015] Notification of acceptance for Regular and Special Session Papers

[Aug. 15, 2015] Deadline for submission of all camera-ready papers

Website: http://www.nolta2015.org/


IEEE iNIS 2015, Indore, India (December 2015)

The primary objective of iNIS is to provide a platform for both hardware and software researchers to interact under one umbrella for further development of efficient and secure information processing technologies. Efficient and secure data sensing, storage and processing play pivotal roles in the current information age. The state-of-the-art nanoelectronic technology based hardware systems caters to the needs of efficient sensing, storage, and computing. At the same time, efficient algorithms and software used for faster analysis and retrieval of desired information are becoming increasingly important. Big data which are large, complex data sets, are now a part of the Internet world. Storing and processing needs of the enormous amount of structured and unstructured data are getting increased challenging. At the same time, Internet of Things (IoT) and cyber-physical systems (CPS) have been evolving with the simultaneous development of hardware and software. The performance and efficiency of the present as well as the future generation of computing and information processing systems are largely dependent upon advances in both hardware and software.

PAPER SUBMISSION DEADLINES:

Submission Deadline: July 20, 2015

Acceptance Notification: September 14, 2015

Submission of Final Version: October 12, 2015


Website: http://www.inisweb.org/



VLSI-D 2015, Kolkata, India (January 2016)

The 29th International Conference on VLSI Design and 15th International Conference on Embedded Systems will be held during January 4-8, 2016 at Kolkata, West Bengal, India. The theme for the conference this year is "Technologies for a Safe and Inclusive World". This 5 day conference comprises: first three days (January 4 to 6, 2016) of main conference followed by Tutorials during the last two days (January 7-8, 2016).

The convergence of technology with modern life has reached a state where dependence of human life on semiconductor technology is ubiquitous. Today semiconductor technology is poised to look beyond its traditional bastions of application with pervasive impact on healthcare, environment, energy, transportation, and disaster management. The 29th International Conference on VLSI Design and the 15th International Conference on Embedded Systems will bring together industry and academia to present front-end technology under the theme of Technologies for a Safe and Inclusive World.

Important dates:

Abstract Submission : July 26 (Sunday), 2015

Full Paper Submission : July 31, 2015 (Friday)

Acceptance Notification : Sep 26, 2015 (Saturday)

Final Camera-ready Version : Oct 30, 2015 (Friday)

Conference website: www.vlsidesignconference.org 


ASP-DAC 2016, Macau, China (January 2016)

As a unique feature of ASP-DAC 2016, the University LSI Design Contest will be held. The aim of the Contest is to encourage education and research on VLSI design at universities and other educational organizations. We solicit designs that fit in one or more of the following categories:

(1) Designed, and actually implemented on chips in universities or other educational organizations during the last two years;

(2) Designs that report actual measurements from implementations;

(3) Innovative design prototypes. 

Interesting or excellent designs selected will be honored by providing the opportunities for presentation in a special session at the conference. Award(s) will be given to a few numbers of outstanding designs, selected from those presented at the conference.

A camera-ready summary is requested to be prepared within 2 pages including figures, tables, and references. It is strongly recommended that measured experimental results and a chip micrograph are included in the summary. Please do not submit the same paper as a regular paper.

Specification of the submission format will be available at http://www.aspdac.com/aspdac2016/

Deadline for summary: 5PM JST (UTC+9) Jul. 8, 2015 

Notification of acceptance: Sep. 14, 2015

Deadline for camera-ready: 5PM JST (UTC+9) Nov. 9, 2015

 

LASCAS 2016, Florianópolis, Brazil (Feb-March 2015)

LASCAS is the international symposium and flagship event of the IEEE Circuits and Systems Society in Latin America. Its seventh edition will take place on Ingleses Beach, Florianopolis, Brazil. The symposium will cover technical novelties and tutorial overviews on circuits and systems topics including but not limited to:
• Analog and Digital Circuits
• Mixed-Mode Circuits

• Biomedical Electronics

  1. •Communication/RF Circuits

  2. •Wireless Sensor Networks

  3. •Nanoelectronics

  4. •Electronic Design Automation

  5. •VLSI Systems and Applications

  6. •FPGA Design and Applications

  7. •Circuit Testing

  8. •Fault Tolerant Circuits

Important dates:

Special Session Proposal: October 24, 2015

Paper Submission: October 24, 2015
Tutorial Submission: October 24, 2015

Notification of acceptance: December 5, 2015

Camera-ready: December 21, 2015

Conference website: http://gse.ufsc.br/lascas2016/lascas2016/


VLSI-DAT 2016, Hsinchu, Taiwan (April 2015)

The 2016 International Symposium on VLSI Design, Automation and Test will be held on April 25-27, 2016 at the Ambassador Hotel, Hsinchu, Taiwan. Original, unpublished papers on all aspects of VLSI Design, Automation and Test are solicited, including but not limited to:

DESIGN TOPICS

- RF, Analog and Mixed-Signal Circuits
- Sensors and Interface Circuits
- Memory Circuits and Systems
- Digital Circuits and ASIC
- Communication Circuits
- Multimedia Processing Circuits
- Biomedical Circuits
- Energy-Harvesting and Power Circuits
- SoC and NoC Architectures
- CPU, DSP and Multicore Architectures
- Designs Using Novel Technologies
- System-in-Package Design
- Ultra Low-Power Circuits, Architectures, and Systems

EDA TOPICS

  1. -Logic and Architecture Synthesis

  2. -Physical Design and Verification

  3. -Design for Manufacturability

  4. -Power Estimation and Optimization

  5. -Design Verification

  6. -Modeling and Simulation

  7. -Electronic System Level Design

  8. -Hardware-Software Co-Design

  9. -Embedded Systems and Software

TEST TOPICS

  1. -Test Generation and Compression

  2. -Design-for-Testability and BIST

  3. -RF, Analog and Mixed-Signal Test

  4. -SOC and System Level Test

  5. -Silicon Debug and Diagnosis

  6. -3D IC and Interposer-Based IC Test

  7. -Yield and Reliability Enhancement

  8. -On-Chip Monitoring

  9. -Adaptive Test

  10. -Test Standards

Prospective authors should submit a self-contained paper with figures and tables electronically through the conference website by October 16, 2015 23:59 (GMT +0800. Details of submission requirements are found in http://expo.itri.org.tw/2016vlsidat


SPI 2016, Turin, Italy (May 2015)

Over the past nineteen years, the IEEE Workshop on Signal and Power Integrity (SPI) has evolved into a forum of exchange on the latest research and developments on design, characterization, modeling, simulation and testing for Signal and Power Integrity at chip, package, board and system level. The workshop brings together developers and researchers from industry and academia in order to encourage cooperation. In view of last years success, the Committee is looking forward to the 20th Edition which will convene in Turin, Italy. The SPI 2016 technical program will include both oral and poster sessions. A number of prominent experts will be giving tutorials on areas of emerging interest. The Conference Proceedings will be published with an ISBN code and will appear in IEEE Xplore.

Topics of Interest:

  1. -Innovative schemes for SI and PI

  2. -Noise reduction techniques

  3. -High-speed link design and modeling

  4. -Power distribution networks

  5. -Electronic packages and microsystems

  6. -3D technologies for IC and packages

  7. -RF, microwave, mixed signal packaging

  8. -Nano-interconnects and nano-structures

  9. -Electromagnetic theory and modeling

  10. -Transmission line theory and modeling

  11. -Macro-modeling, reduced order models

  12. -Simulation tools for SI and PI

  13. -Electromagnetic Compatibility

  14. -Design methodology/flow

  15. -Measurements

  16. -Jitter and noise modeling

  17. -Chip-package co-design

  18. -Novel CAD concepts

Important Dates:

Paper submission (2-4 pages): January 31, 2016

Notification of acceptance: February 28, 2016

Conference website: http://www.spi2016.org/


IEEE RFIC 2016, San Francisco, USA (May 2015)

The 2016 IEEE Radio Frequency Integrated Circuits Symposium (RFIC 2016) will be held in San Francisco, CA, USA, on May 22-24, 2016. For the latest information, please visit: rfic-ieee.org. 

Technical Areas: The conference will solicit papers describing original work in RFIC circuits, system engineering, design methodology, RF modeling and CAD simulation, RFIC technologies, devices, fabrication, testing, reliability, packaging and modules to support RF applications.

Technical Format: The conference starts on Sunday, May 22, 2016 with workshops and short courses, followed by two Plenary talks and Reception embedded with joint Industry Showcase and Interactive Forum. Monday, May 23 and Tuesday, May 24, 2016 will be comprised of presentations of contributed papers and special lunch-time panel sessions. RFIC also seeks 2-page short-format original industrial-only submissions on all the areas listed above. RFIC Symposium has Best Student Paper Award and Industry Best Paper Award.

Journal Submissions: Selected papers will be invited for special issues in IEEE Journal of Solid State Circuits and Transactions on Microwave Theory and Techniques.

Microwave Week 2016: The RFIC 2016 will be held in conjunction with the IEEE MTT-S International Microwave Symposium (IMS). Microwave Week 2016 will start with RFIC Symposium, and followed by IMS Symposium, Microwave Historical Exhibit and ARFTG Microwave Measurement Conference.

Industrial Exhibition: This two-day Exhibition expects about 1000 Exhibitors who represent the state-of-the-art of the industry covering everything needed for RF and microwave production including materials, technologies, components and subsystems, as well as RF IC design and simulation software, and measurement and fabrication equipment. It is a perfect venue for engineers to find the newest on RF and microwave ICs.

Electronic Submission Deadlines

Technical Paper Summaries in PDF format:8 January 2016

Final Manuscripts for the Digest and CD-ROM: 9 March 2016