Our Editors-in-Chief’s Top Picks
The Editors-in-Chief of our CASS publications have selected some noteworthy papers from the recent issues of our journals:
IEEE Open Journal of Circuits and Systems
Loop Dynamics Analysis of PAM-4 Mueller–Muller Clock and Data Recovery System
by Kunal Yadav; Ping-Hsuan Hsieh; Anthony Chan Carusone
Why it matters:
ADC-based receivers are becoming increasingly popular in wireline communication. In this paper, the authors quantify the performance of linear and signed Mueller–Muller phase detectors with a small-signal linear model. Different equalization configurations of continuous-time linear equalizer and feed-forward equalizer are evaluated from a phase detector performance perspective to enable high CDR loop bandwidth. The impact of loop latency on the timing recovery of ADC-based PAM-4 receivers is also analyzed and demonstrated using accurate behavioral simulations.
Demonstrating Analog Inference on the BrainScaleS-2 Mobile System
by Y. Stradmann et al.
Why it matters:
BrainScaleS-2 is one of the popular analog neural platforms. This paper presents the BrainScaleS-2 mobile system as a compact analog inference engine based on the BrainScaleS-2 ASIC and demonstrate its capabilities at classifying a medical electrocardiogram dataset. Patients with atrial fibrillation are correctly identified with a detection rate of (93.7 ± 0.7) % at (14.0 ± 1.0) % false positives, demonstrating the BrainScaleS-2 ASIC to be operated reliably outside a specialized lab setting.
by W.-C. Wang et al.
Why it matters:
Terahertz (THz) imaging systems have great potential for material identification, security screening, circuit inspection, bioinformatics and bio-imaging, but THz emitters and detectors are still extremely expensive. The singlepixel compressive sensing imaging technique is a potential solution for the implementation of a THz imaging system. This paper presents a tensor-based single-pixel compressive sensing model and a reconstruction algorithm for THz single-pixel imaging systems based on the generalized tensor compressive sensing framework. The proposed FPGA-based tensor-based compressive sensing processor achieved a throughput of 1127 frames/sec and had the highest normalized hardware efficiency compared to state-of-the-art cases.
IEEE Transactions on Circuits and Systems I: Regular Papers
A. Kosuge and T. Kuroda, "Proximity Wireless Communication Technologies: An Overview and Design Guidelines," IEEE Transactions on Circuits and Systems I: Regular Papers, vol. 69, no. 11, pp. 4317-4330, Nov. 2022.
https://ieeexplore.ieee.org/document/9906554
A. T. Ramkaj, M. J. M. Pelgrom, M. S. J. Steyaert, and F. Tavernier, "A 28nm CMOS Triple-Latch Feed-Forward Dynamic Comparator with <27ps/1V and <70ps/0.6V Delay at 5mV-Sensitivity," IEEE Transactions on Circuits and Systems I: Regular Papers, vol. 69, no. 11, pp. 4404-4414, Nov. 2022.
https://ieeexplore.ieee.org/document/9866101
Z. Yue, Y. Wang, Y. Qin, L. Liu, S. Wei, and Y. Shouyi, "BR-CIM: An Efficient Binary Representation Computation-In-Memory Design," IEEE Transactions on Circuits and Systems I: Regular Papers, vol. 69, no. 10, pp. 3940-3953, Oct. 2022. https://ieeexplore.ieee.org/document/9826410
IEEE Transactions on Circuits and Systems for Video Technology
R. Song, K. Huang, Z. Wang, and H. Shen,"A Reconfigurable Convolution-in-Pixel CMOS Image Sensor Architecture," IEEE Transactions on Circuits and Systems for Video Technology, vol. 32, no. 10, pp. 7212-7225, Oct. 2022. https://ieeexplore.ieee.org/document/9785835
S. Wang, C. Jia, X. Zhang, S. Wang, S. Ma, and W. Gao, "A Pixel-Level Segmentation-Synthesis Framework for Dynamic Texture Video Compression," IEEE Transactions on Circuits and Systems for Video Technology, vol. 32, no. 10, pp. 7077-7091, Oct. 2022. https://ieeexplore.ieee.org/document/9763530
T. Kimura, T. Matsubara, and K. Uehara,"Topology-Aware Flow-Based Point Cloud Generation,"IEEE Transactions on Circuits and Systems for Video Technology, vol. 32, no. 11, pp. 7967-7982, Nov. 2022. https://ieeexplore.ieee.org/document/9791323
IEEE Journal of Emerging and Selected Topics in Circuits and Systems
G. De Micheli, J-H. R. Jiang, R. Rand, K. Smith, and M. Soeken, "Advances in Quantum Computation and Quantum Technologies: A Design Automation Perspective,” IEEE Journal of Emerging and Selected Topics in Circuits and Systems, Vol. 12, No 3, pp. 584-601, Sep. 2022. https://ieeexplore.ieee.org/document/9881555
L. Giuffrida, D. Volpe, G. A. Cirillo, M. Zamboni, and G. Turvani, "Engineering Grover Adaptive Search: Exploring the Degrees of Freedom for Efficient QUBO Solving,” IEEE Journal of Emerging and Selected Topics in Circuits and Systems, Vol. 12, No. 3, pp.614-623, Sep. 2022. https://ieeexplore.ieee.org/document/9869620
L. Gemma, M. Bernard, and D. Brunelli, "An Optical Tool to Optimize the Output of a Photonic Integrated Chip Architecture,” IEEE Journal of Emerging and Selected Topics in Circuits and Systems, Vol. 12, No. 3, pp. 694–702, Sep. 2022. https://ieeexplore.ieee.org/document/9864645
IEEE Circuits and Systems Magazine
S. Pennisi, "Pandemic, Shortages, and Electronic Engineering," in IEEE Circuits and Systems Magazine, vol. 22, no. 3, pp. 41-49, thirdquarter 2022, doi: 10.1109/MCAS.2022.3189891.
https://ieeexplore.ieee.org/document/9880507
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TVLSI - Call for Editor-in-Chief Nominations
The IEEE Transactions on Very Large Scale Integration (VLSI) Systems (TVLSI) is published as an archival monthly journal under the co-sponsorship of the IEEE Circuits and Systems Society, the IEEE Computer Society, and the IEEE Solid-State Circuits Society.
We are currently seeking nominations and applications for the position of Editor-in-Chief (EiC) of the IEEE Transactions on Very Large Scale Integration Systems (TVSLI) for the publications years 2023 and 2024.
The design and realization of microelectronic systems based on nanometer VLSI technologies require multidisciplinary collaboration in the fields of systems architecture, logic and circuit design, integrated circuit fabrication, packaging, testing, systems applications, novel systems platforms (such as 3-D integration), and emerging technologies. Generation of specifications, design, and verification must be performed at all abstraction levels, including the system, register-transfer, logic, circuit, transistor, process, and materials levels. IEEE TVLSI serves as a common forum to address these critical areas. The Editorial Board, consisting of international experts, invites original articles which emphasize and focus on the novel systems integration aspects of microelectronic systems, including interactions among systems design and partitioning, logic and memory design, digital and analog circuit design, physical design, layout synthesis, CAD tools, integrated circuit fabrication, testing and packaging, emerging technologies, and systems level design and analysis. Coverage of these transactions will therefore focus on nanometer VLSI systems integration. For more information on the TVLSI website.
Nominees:
Applicants must have strong, relevant experience in roles such as author, reviewer, and associate editor for TVLSI and/or other related journals, and/or a technical program chair or similar roles in high-quality, peer-reviewed conferences. To attract high-quality articles to the transactions, the EiC must also be a well-recognized leader in his/her areas of expertise. Key qualities of the EiC are an outstanding understanding of the needs of the research community at academic as well as industrial and government laboratories, awareness of changing emphases in research areas and development of emerging fields, plus the administrative skills to manage the editorial cycle in a timely fashion. The EiC must also be able to attract respected experts to his/her Editorial Board. The EiC must have good interpersonal skills to maintain good rapport with authors, editors, reviewers, and the IEEE staff.
Applications or nominations must include:
- An application/nomination letter
- A complete curriculum vitae (CV)
- A personal statement summarizing their vision and plans for TVLSI
- A letter from their employer indicating support for the EiC activity
The target start date for the new EiC is anticipated to be 1 February 2023.
Submissions:
Please send an email with the materials as a single zip file with the subject line
"IEEE TVLSI EiC application" to Yehea Ismail (y.ismail @aucegypt.edu).
Make sure to receive a confirmation within two days of submission.
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Latest Tables of Contents of CAS Sponsored Journals
The latest issues of our CAS sponored journals have been published and the tables of contents can be accessed through the following links:
- IEEE Transactions on Circuits and Systems I: Regular Papers
- IEEE Transactions on Circuits and Systems II: Express Briefs
- IEEE Transactions on Circuits and Systems for Video Technology
- IEEE Journal on Emerging and Selected Topics in Circuits and Systems
- IEEE Circuits and Systems Magazine
- IEEE Transactions on Biomedical Circuits and Systems
- IEEE Design and Test Magaz
- IEEE Open Journal of Circuits and Systems