CONTENTS
- Society News
- New CAS Fellows
- 2019 IEEE CAS Society Call for Awards Nominations — F. Maloberti
- New DL Slides Added to the CASS Resource Center
- Chapter News
- The Spain CAS Chapter Won the Best Chapter Award — A. Lopez-Martin
- Santa Clara Valley Chapter Q4 2018 Report — I. Bashir
- DLP News
- International Forum on New Frontiers in IC Design at Shanghai Jiao Tong University — E. Mak
- AI Forum News
- CAS Artificial Intelligence for Industry Forum — I. Bashir
- Symposium News
- AI Compute Symposium at the IBM T.J. Watson Research Center THINKLab in Yorktown Heights, NY — R. Joshi, M. Ziegler, A. Kumar, and E. Alarcon
- Publication News
- International Symposium on Integrated Circuits and Systems Special Issues in TCAS-I, TCAS-II and TBioCAS
- Latest Tables of Contents of CAS Sponsored Journals
- Supplementary Material to Part 2 of Special Issue on Prof. Alfred Fettweis Published in IEEE CAS Magazine, Q4 2018
- Call for Papers & Invitations
- IEEE ISCAS 2019, Sapporo, Japan (May 2019)
- ASP-DAC 2019, Tokyo, Japan (Jan 2019)
- LASCAS 2019, Armenia, Colombia (Feb 2019)
- RFIC 2019, Boston, USA (Jun 2019)
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Schedule & Submission
This newsletter is published bimonthly and the tentative publication dates are in the middle of February, April, June, August, October and December. Except for the inaugural issue which had experienced some delay, all issues are scheduled to appear on the 15th of the month of publication. However, a few days of delay or advancement is possible due to various administrative or logistical problems.
Your contributions are welcome. Any suitable contribution will appear in the next issue. The tentative cut-off dates for submission of contributions are the 10th of the month of publication. For example, if you wish to publish an article for the June issue, you should send it to the Editor-in-Chief or any Associate Editor before June 10. All contributions will go through a very brief suitability screening.
C. K. Michael Tse
Editor-in-Chief, IEEE CASS Newsletter
Email for submission: cktse@ieee.org