IEEE Circuits and Systems Society Newsletter | Volume 15 | Issue 3 | June 2021 | CURRENT/PAST ISSUES

CALL FOR PAPERS & INVITATIONS

IEEE ISCAS 2022, Austin, USA, 2022

The IEEE International Symposium on Circuits and Systems (ISCAS) is the flagship conference of the IEEE Circuits and Systems (CAS) Society and the world’s premiere networking forum for researchers in the highly active fields of theory, design and implementation of circuits and systems. 

ISCAS 2022 will be held in Austin Texas, one of the fastest growing cities in the United States. Much of this growth is attributable to the rapidly growing tech sector in the Austin metropolitan area. The large and dynamic tech sector will provide an opportunity to include a strong industrial presence in the conference.

Following the lead of the ISCAS 2021 organizers that used a hybrid format whereby some participants attended in person and others participated virtually, a hybrid format will be established for ISCAS 2022. As we hopefully enter the post-pandemic era, our intentions are to expand the on-site in-person activities but for those that either can-not or prefer to not attend in person, for whatever reason, we also plan on providing the opportunity for anyone to participate virtually. In keeping with the tradition of maintaining a high-quality technical program, the paper submission procedure and the review guidelines will be identical irrespective of whether the presentation is made in-person in a lecture session, in-person in a poster session, or virtually.

New to ISCAS 2022 will be an early-bird paper submission option and correspondingly a somewhat earlier review decision date on submitted papers. This should provide additional lead time for those that need to obtain a visa. We are tentatively planning on waiving tutorial registration fees for authors of accepted early-bird submissions as well. Additional details will be provided later.

We look forward to your participation in ISCAS 2022 in person, in Austin Texas, or virtually if that better suits your needs.

Symposium Website: www.iscas2022.org


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ICME 2021, Shenzhen, China (July 2021)

The IEEE International Conference on Multimedia & Expo (ICME) has been the flagship multimedia conference sponsored by four IEEE societies since 2000. ICME aims at promoting the exchange of the latest advances in multimedia technologies, systems, and applications from both the research and development perspectives. ICME attracts well over 1000 submissions each year, serving as the prime forum for the dissemination of knowledge in the multimedia field.

ICME 2021 will take place on 5-9 July 2021, Shenzhen, China. ICME 2021 will convene leading researchers and practitioners to share the latest developments and advances in the discipline. The conference will showcase high quality oral and poster presentations, as well as relevant Workshops sponsored by IEEE societies. An exposition of multimedia products, animations, and industries will be also held in conjunction with the conference. Additionally, exceptional papers and contributors will be selected and recognized with prestigious awards.

Topics of interest include, but are not limited to:

  • Artificial Intelligence for Multimedia
  • 3D multimedia, AR/VR, and Immersive Media
  • Emerging Multimedia Applications and Technologies
  • Image/Video Processing
  • Multimedia Analysis and Understanding  
  • Multimedia Communications, Networking, and Mobility
  • Multimedia Databases and Data Mining
  • Multimedia for Society and Health
  • Multimedia Interaction
  • Multimedia Quality Assessment and Metrics
  • Multimedia Security, Privacy, and Forensics
  • Multimedia Software, Hardware, and Application Systems
  • Multimedia Standards, Trends, and Related Research
  • Multi-modal Media Computing and Human-Machine Interaction
  • Social Media Analysis and Applications
  • Speech/Audio Processing

Paper Submission Deadlines

  • Regular Paper Submission (including special sessions) - 29 November 2020
  • Submission of Papers to Workshops and Other Tracks - 13 March 2021
  • Industry/Application Track Paper Submission - 22 March 2021

Proposal Submission Deadlines

  • Special Session Proposals - 1 November 2020
  • Panel Proposals - 1 November 2020
  • Grand Challenge Proposals - 1 November 2020
  • Workshop Proposals - 1 November 2020
  • Tutorial Proposals - 1 November 2020
  • Open Source Competition - 1 March 2021
  • Demo Proposals - 2 April 2021
  • Industry Expo Proposals - 1 May 2021

Website: https://2021.ieeeicme.org/


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SMACD/PRIME 2021, Virtual (July 2021)

On behalf of the organizing committee, it is our pleasure to send you the call for papers of the 2021 edition of the SMACD - International Conference on Synthesis, Modeling, Analysis and Simulation Methods, and Applications to Circuit Design as well as the call for papers of the PRIME 2021 16th Conference on Ph.D. Research in Microelectronics and Electronics.

The International Conference on Synthesis, Modeling, Analysis and Simulation Methods and Applications to Circuit Design (SMACD) was originally planned in Erfurt, Germany, but will be held virtually, as a forum devoted to modeling, simulation, and synthesis for Analog, Mixed-signal, RF (AMS/RF) and multi-domain (nanoelectronics, biological, MEMS, optoelectronics, etc.) integrated circuits and systems. Experiences with modeling, simulation, and synthesis techniques including machine-learning and artificial intelligence in diverse application areas are also welcomed. Objective technologies include CMOS, beyond CMOS, and More-than-Moore such as MEMS, power devices, sensors, passives, etc. SMACD 2021 is Technically Co-sponsored by IEEE, IEEE CEDA, and IEEE CAS. The conference proceedings will be submitted for inclusion in IEEExplore. 

PRIME has been established over the recent years as an important conference where Ph.D. students and post-docs with less than one-year of post-PhD experience can present their research results and network with experts from industry, academia, and research. PRIME 2021 will feature a conference program reflecting the wide spectrum of research topics in Microelectronics and Electronics, building bridges between various research fields. In addition to the technical sessions, opportunities for the conference attendees will be the keynote talks, workshops, social events, and conference proceedings will be submitted for IEEE Xplorer. PRIME 2021 is seeking original papers in the areas given on the Call for Papers.

See website for details.


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MWSCAS 2021, Virtual (August 2021)

The IEEE International Midwest Symposium on Circuits and Systems (MWSCAS) is the oldest, and now the flagship, Circuits and Systems symposium. The 64th meeting of the MWSCAS is planned to be hosted by Michigan State University, in East Lansing, Michigan, USA, from Aug 8-11, 2021. The MWSCAS 2021 has pivoted to fully virtual symposium to add a sense of certainty supported and managed by the convenient CONFlux virtual platform . It will include oral and poster sessions, a student paper contest, keynote addresses, regular and special sessions, and tutorials presented by world experts in wide range of circuits and systems topics. The 2021 Symposium theme is artificial intelligence (AI) and autonomous circuits and systems, and hopes to bring forward solutions to consequences of the COVID-19, from detection, testing to predictions. 

Prospective authors are invited to submit a full paper (4 pages) describing original work through the on-line submission system for the conference through a link on the MWSCAS 2021 conference web- site. Papers should follow the formatting instructions given in the author’s kit on the website. Papers will be accepted for either lecture or poster presentation. Review criteria for both lecture and poster presentation formats are identical; the presentation format will be chosen to facilitate topical session grouping and time constraints. Students are encouraged to participate in the Best Student Paper Award contest. Submissions of demos and proposals for tutorials and special sessions are also solicited. Accepted papers will be published in the MWSCAS 2021 Proceedings subject to advance registration of at least one of the authors at the author rate. All papers published in the MWSCAS 2021 Proceedings will be submitted for inclusion into IEEEXplore. Moreover, a special issue will be published in the Springer journal of Analog Integrated Circuits and Signal processing based on extended versions of papers presented at the conference. Other cutting-edge special issues will be streamlined for IEEE transactions on circuits and systems (CAS_I, CAS_II, and TBioCAS) based on extended versions of symposium papers. 

For details, see the conference website.

Important Dates (submission deadlines)

  • March 1, 2021 - Special Sessions Proposals
  • March 8, 2021 - Regular Paper
  • April 5, 2021 - Tutorial Session Proposals
  • April 26, 2021 - Notice of Paper Acceptance
  • May 17, 2021 - Camera-Ready Paper Due


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SBCCI 2021, Virtual (August 2021)

SBCCI2021

Chip in the Fields
August 23 to 27, 2021
Virtual Event (from Campinas, Brazil)

Symposium on Integrated Circuits and Systems Design (SBCCI)  is an international forum dedicated to integrated circuits and systems design, test and electronic design automation (EDA), held annually in Brazil. The 34th SBCCI will take place in Campinas, an economic center in Brazil. The goal of the symposium is to bring together researchers in the areas of EDA, design and test of integrated circuits and systems. The scope of the symposium includes technical sessions, tutorials and panels, as well as an exhibition and working group meetings. 

The proceedings will be submitted to IEEE Xplore and ACM Digital Library. The best papers presented at the symposium will be invited to resubmit an extended version to be considered for publication in the IEEE Design & Test and in the Springer Nature ALOG (Analog Integrated Circuits and Signal Processing). Information about paper submission is available on the conference webpage.

Topics of interest include, but are not limited to:

  • Analog IC design
  • Design and modeling languages and applications
  • Design for aging, reliability and robustness
  • Design for test and testability issues
  • Embedded systems design 
  • Electronic Design Automation (EDA)
  • Formal methods and verification
  • HW/SW co-design, co-simulation and co-verification
  • Logical and physical analysis, design and synthesis
  • Low-power, energy-efficient and thermal-aware design
  • Machine learning solutions for integrated circuit design
  • Many- and multi-core SoC architecture
  • Nanocomputing
  • Mixed-Signal IC design
  • Networks-on-chip and NoC-based system design
  • Radio-Frequency IC design
  • Reconfigurable architectures and FPGA applications
  • Security in many-core systems
  • System simulation and validation
  • System-Level design methodologies and high-level synthesis
  • Testability issues, design for test techniques
  • Test of analog, RF and mixed-signal circuits and systems

Important Dates (NEW):
Paper Submission Deadline:  April 26th, 2021
Notification of Acceptance:    May 24th, 2021
Camera-Ready Deadline:        June 7th, 2021

Website: www.sbcci.org.br

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ISICAS 2021, Singapore (September 2021)

The International Symposium on Integrated Circuits and Systems (ISICAS), to be held in September 3-4, 2021 in Singapore, invites high-quality submissions presenting original work in the areas of integrated circuits and systems. Topics in the areas of analogue, digital, power, energy, biomedical, sensor interfaces, and communication systems are welcome. The submissions must describe integrated circuit and system implementations, with experimental results. Extended versions of previously published recent conference papers with significant additional materials are also welcome. 

The symposium will not produce proceedings as all accepted papers will be published in Special Issues of TCAS-I, TCAS-II, TBioCAS, and OJCAS shortly after the results are presented at ISICAS 2021. The deadline has been extended till 7 March, 2021. 

Conference website: http://www.ieee-isicas.org/

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VLSI-SoC 2021, Singapore (October 2021)

SLCI-SoC

VLSI-SoC 2021 is the 29th in a series of international conferences sponsored by the International Federation for Information Processing Technical Committee 10 Working Group 5, IEEE CEDA, and IEEE CASS, which explore the state-of-the-art in the areas of Very Large Scale Integration (VLSI) and System-on-Chip (SoC) design. The purpose of VLSI-SoC is to provide a forum to exchange ideas and showcase academic as well as industrial research in architectures, circuits, devices, design automation, verification, test, and security, within digital, analog, and mixedsignal systems.

VLSI-SoC 2021 will be held under the theme "Intelligent and Secure Edge Computing," exploring the design and optimization challenges around AI, machine learning, and cybersecurity on distributed and heterogeneous low-power circuits and systems powered by CMOS and beyond-CMOS technologies. VLSI-SoC 2021 will be held in Singapore.

Topics of interest include, but are not limited to:

  • Analog mixed-signal, sensors and RF
  • VLSI circuits and SoC design
  • Embedded systems design and software
  • CAD tools and methodologies for digital IC design and optimization
  • Verification, modeling and prototyping
  • Design for testability, reliability and fault tolerance
  • Hardware security
  • Emerging technologies and new computing paradigms

Abstract registration : April 26, 2021
Full paper submission: May 03, 2021
Special session proposal: May 03, 2021
Notification of acceptance: June 28, 2021
Camera ready: July 22, 2021

Website: https://vlsisoc.github.io/

© IEEE CIRCUITS AND SYSTEMS SOCIETY 2021